Integrated circuitry and method of forming a field effect transistor

ABSTRACT

A method of forming a field effect transistor includes, a) providing a silicon substrate having impurity doping of a first conductivity type; b) providing source and drain diffusion regions of a second conductivity type within the silicon substrate, the source region and the drain region being spaced from one another to define a channel region therebetween within the silicon substrate; c) providing a gate relative to the silicon substrate operatively adjacent the channel region; and d) providing respective ohmic electrical contacts to the source region and the drain region, the electrical contact to the source region comprising a substrate leaking junction, the electrical connection to the drain region not comprising a substrate leaking junction. A field effect transistor is also disclosed.

RELATED PATENT DATA

This patent resulted from a continuation application of U.S. patentapplication Ser. No. 08/530,662, filed Sep. 20, 1995, U.S. Pat. No.5,895,776, entitled “Integrated Circuitry And Method Of Forming A FieldEffect Transistor”, listing the inventor as H. Montgomery Manning.

PATENT RIGHTS STATEMENT

This invention was made with Government support under Contract No.MDA972-92-C-0054 awarded by Advanced Research Projects Agency (ARPA).The Government has certain rights in this invention.

TECHNICAL FIELD

This invention relates to integrated circuitry and to methods of formingfield effect transistors.

BACKGROUND OF THE INVENTION

Field effect transistors are comprised of a pair of diffusion regions,referred to as a source and a drain, spaced apart within asemiconductive substrate. Such include a gate provided adjacent theseparation region between the diffusion regions for imparting anelectric field to enable current to flow between the diffusion regions.The substrate area adjacent the gate and between the diffusion regionsis referred to as the channel. The semiconductive substrate typicallycomprises a bulk monocrystalline silicon substrate having a lightconductivity dopant impurity concentration. Alternately, the substratecan be provided in the form of a thin layer of lightly dopedsemiconductive material (typically monocrystalline silicon) over anunderlying insulating layer. Such are commonly referred to assemiconductor-on-insulator (SOI) constructions.

The diffusion regions in SOI can extend completely or partially throughthe thin silicon layer. Further, the SOI device can operate in apartially depleted or fully depleted mode. Such refers to the depletionregion formed in the SOI layer when the channel region is inverted byapplied voltage. If the depletion region extends through the entire SOIlayer, the device is considered to be fully depleted. If on the otherhand the depletion region extends only partly through the SOI layer, thedevice is considered to be partially depleted. Usually, the source anddrain regions in a partially depleted device extend only partiallythrough the SOI layer. Usually, the source and drain regions in a fullydepleted device extend completely through the SOI layer.

Integrated circuitry fabrication technology continues to strive toincrease circuit density, and thereby minimize the size and channellengths of field effect transistors. Improvements in technology haveresulted in reduction of field effect transistor size from long-channeldevices (i.e., channel lengths greater than 2 microns) to short-channeldevices (i.e., channel lengths less than 2 microns).

In an n-type (NMOS) device, when the gate voltage is above the thresholdvoltage, and the drain voltage becomes sufficiently high so that thedevice is in the saturation region, the inversion region in the channelbecomes pinched off near the drain and electrons are accelerated acrossthis pinch-off region from the channel to the drain. At certain gate anddrain bias conditions, the electric fields in the pinch-off region arehigh enough to cause the accelerated electrons to impact into substrateatoms. The result of this impact is the generation of additionalelectron-hole pairs. The electrons flow either into the gate oxide orgate conductor, or to the drain. The holes flow into the substrate. Inbulk MOS devices, these excess holes are collected at a substrate tie. Asubstrate tie constitutes a fourth terminal of a MOS device and controlsthe substrate bias of the device. If the substrate tie terminal is at alarge distance from the device, or if the generated holes are of a veryhigh number, excess holes collect under the device's channel region.

These excess holes locally bias the substrate to a potential that ishigher than that being provided at the substrate tie. If this higherpotential rises above the source potential of the NMOS device, thesource/body junction becomes forward biased and a parasitic n-p-nbipolar device is turned “on”. The source acts as the emitter, the bodyis the base, and the drain is the collector. At this point, the NMOSdevice has entered what is referred to as the “snap-back” regime, andthe drain current rises significantly above the intrinsic saturationcurrent of the device. Operating an NMOS device in snap-backsignificantly reduces its lifetime, and is not a preferred mode ofoperation in typical integrated circuits.

Snap-back is a much larger concern with partially depleted SOI devicesbecause there is no substrate tie to collect excess holes that aregenerated during impact ionization. Therefore, the substrate rises muchsooner and the snap-back voltage is reduced when compared to anequivalent bulk-MOS device. Further, in SOI a common electricalcharacteristic observed is the “kink” effect. This is a result of thesame phenomenon as snap-back, but occurs at lower drain electric fields.The “kink” in the SOI MOS devices Id-Vd curves (when the device is insaturation) is the result of a rise in the substrate potential due tohole injection from impact ionization at the drain. The holes do notcause forward bias of the source/substrate junction, but the small risein substrate potential causes the threshold voltage of the MOS device toslightly decrease, thereby increasing the drain current and causing thekink Id-Vd characteristics.

Again, one prior art way of countering this phenomena is to add aconductive substrate tie to collect excess holes that are injected intothe substrate. This prevents local biasing of the substrate, andtherefore prevents the kink effect and increases the snapback voltage.In bulk devices, this substrate contact can be made anywhere in thevicinity of the device since the substrate is continuous from thesubstrate tie to the device body. However in SOI devices, the devicebody may be isolated from adjacent devices. To make body contact to sucha device, an added p+ active area is abutted to the typical n+ source ofan n-channel device. The p+ active area adjacent to or within the n+source makes ohmic contact to the body of the device. However, itrequires additional area, and a method to contact the p+ region as wellas the n+ regions.

Another method for making this body contact in SOI is to not completelyisolate one field effect transistor region from another. This, however,eliminates one of the major advantages of SOI, that of being able toreduce active area spacing from n-channel to p-channel devices.

It would be desirable to develop a method to provide the substrateelectrical contact to completely isolated devices without requiringadded layout area.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below withreference to the following accompanying drawings.

FIG. 1 is a diagrammatic sectional view of a semiconductor waferfragment at one processing step in accordance with the invention.

FIG. 2 is a view of the FIG. 1 wafer fragment at a processing stepsubsequent to that shown by FIG. 1.

FIG. 3 is a view of the FIG. 1 wafer fragment shown at a processing stepsubsequent to that shown by FIG. 2.

FIG. 4 is a diagrammatic sectional view of an alternate embodimentsemiconductor wafer fragment at one processing step in accordance withthe invention.

FIG. 5 is a diagrammatic sectional view of another alternate embodimentsemiconductor wafer fragment at one processing step in accordance withthe invention.

FIG. 6 is a diagrammatic sectional view of still another alternateembodiment semiconductor wafer fragment at one processing step inaccordance with the invention.

FIG. 7 is a diagrammatic sectional view of yet another alternateembodiment semiconductor wafer fragment at one processing step inaccordance with the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

This disclosure of the invention is submitted in furtherance of theconstitutional purposes of the U.S. Patent Laws “to promote the progressof science and useful arts” (Article 1, Section 8).

In accordance with one aspect of the invention, a method of forming afield effect transistor comprises the following steps:

providing a silicon substrate having impurity doping of a firstconductivity type;

providing source and drain diffusion regions of a second conductivitytype within the silicon substrate, the source region and the drainregion being spaced from one another to define a channel regiontherebetween within the silicon substrate;

providing a gate relative to the silicon substrate operatively adjacentthe channel region; and

providing respective ohmic electrical contacts to the source region andthe drain region, the electrical contact to the source region comprisinga substrate leaking junction, the electrical connection to the drainregion not comprising a substrate leaking junction.

In accordance with another aspect of the invention, a field effecttransistor comprises:

a silicon substrate having impurity doping of a first conductivity type;

a second conductivity type source diffusion region and a secondconductivity type drain diffusion region within the silicon substrate,the source region and the drain region being spaced from one another todefine a channel region therebetween within the silicon substrate;

a gate positioned relative to the silicon substrate operatively adjacentthe channel region;

an insulating dielectric layer overlying the silicon substrate; and

respective ohmic electrical contacts provided through the insulatingdielectric layer to the source region and to the drain region, theelectrical contact to the source region comprising a substrate leakingjunction, the electrical connection to the drain region not comprising asubstrate leaking junction.

The discussion proceeds initially with reference to FIGS. 1-3 of onemethod of forming a field effect transistor in accordance with theinvention. FIG. 1 illustrates a semiconductor wafer fragment indicatedgenerally by reference numeral 10. Such comprises a bulk substrateregion 12 having an electrically insulating layer 14 provided thereatop.A silicon layer 16, preferably monocrystalline silicon, is providedoutwardly of insulating layer 14. Such is lightly doped with aconductivity enhancing impurity of a first type, A typical and preferreddopant concentration for layer 16 is 5×10¹⁷ ions/cm³. Accordingly inthis first described embodiment, layer 16 comprises a silicon substratein the form of a silicon-on-insulator layer.

Field oxide regions 18 are provided relative to silicon substrate 16 asshown, as well as an intervening field effect transistor gateconstruction 20. Such comprises a gate oxide layer 22 having anoverlying conductive region 24. Conductive region 24 would typicallycomprise conductively doped polysilicon having an overlying layer of asilicide, such as WSi_(x). Electrically insulative sidewall spacers 26are provided about gate layer 24 and gate oxide layer 22. An insulativecap (not shown) would also preferably be provided. Source and draindiffusion regions 28 and 30, respectively, of a second conductivity typeare provided within silicon substrate 16. Such are spaced from oneanother as shown to define a channel region 32 therebetween withinsilicon substrate layer 16. Gate 20 is provided relative to siliconsubstrate layer 16 operatively adjacent channel region 32. In thepreferred embodiment, the first conductivity type is “p” and the secondconductivity type is “n”. Further, and in the context of an SOIconstruction, at least source diffusion region 28 extends only partiallythrough the silicon on insulator layer, with both of the source anddrain preferably extending only partially through the silicon oninsulator layer as shown.

An insulating dielectric layer 32 is provided over silicon substrate 16.A drain contact opening 34 is etched therethrough to drain region 30. Anelectrically conductive barrier layer 36 (preferably TiN) is providedover insulating dielectric layer 32 and within drain contact opening 34in electrical connection with drain 30. Utilization of such a diffusionbarrier layer is common in microelectronic fabrication to preventinterdiffusion or reaction of a subsequently deposited metalizationlayer and the underlying silicon substrate. Such also provides the addedbenefit of preventing junction spiking from occurring through thediffusion region into the substrate in operation of the circuitry.

Referring to. FIG. 2, a source contact opening 38 is etched throughelectrically conductive barrier layer 36 and insulating dielectric layer32 to source region 28.

Referring to FIG. 3, an electrically conductive layer 40 (preferablytungsten or aluminum) is provided over barrier layer 36 and withinsource and drain contact openings 38 and 34, respectively, to preferablyfill such openings with electrically conductive material, and providepatterned conductive lines. Conductive layer 40 and underlyingelectrically conductive barrier layer 36 are patterned as shown todefine a pair of ohmic electrical contacts 42 and 44 to source and drainregions 28 and 30, respectively. Electrical contact 42 to source region28 is oriented to extend outwardly away relative to silicon substrate16, and comprises a substrate leaking junction due to reaction ofelectrically conductive layer 42 with the silicon in the source region28 due to a lack of barrier layer material 36 within source contactopening 38. Drain contact 44, on the other hand, is not a substrateleaking junction due to presence of barrier layer material 36 withindrain contact opening 34.

Thus, a substrate leaking junction preferably in the form of a junctionspike is created at the source therethrough to the substrate. At thesource, no leakage would effectively occur with the prior art since thesource is typically biased at the same potential as the substrate.However in accordance with this preferred aspect of the invention, ohmiccontact is provided to the source junction as well as to the substrate,but not at the drain, to provide the desired substrate tie to contendwith kink effect and low snapback voltage.

FIG. 7 illustrates an alternate embodiment wafer fragment 10 a havingthe same essential construction as FIG. 3, but utilizing bulk siliconsubstrate 12 for formation of the field effect transistor, as opposed toa SOI device.

FIGS. 1-3 and 7 illustrate but one example of providing a substrateleaking junction relative to a source, but not a drain, in a fieldeffect transistor. FIG. 4 illustrates another alternate embodiment waferfragment 10 b. Like numerals from the first described embodiment areutilized where appropriate, with differences being indicated by thesuffix “b”, or with different numerals. In this embodiment, sourcecontact opening 38 b is etched partially into source region 28 toprovide the electrical contact within source region 28. TiN barrierlayer 36 b is also provided within contact opening 38 b and inelectrical connection with source 28. The deeper provision of a contact42 b within diffusion region 28 will desirably facilitate formation of asubstrate leaking junction through source diffusion region 28 to thebulk material of layer 16.

FIG. 5 illustrates another alternate embodiment wafer fragment 10 c.Like numerals from the first described embodiment are utilized asappropriate, with differences being indicated by the suffix “c” or withdifferent numerals. Here, source contact opening 38 c is etchedcompletely through source region 28 to provide direct contact of theconductive material of contact 42 c with the semiconductive material ofsilicon substrate 16. A barrier layer 36 c is again utilized as shown.

Yet another alternate example for providing a substrate leaking junctionfor the source and not the drain is described with reference to FIG. 6.Again, like numerals from the first described embodiment are utilizedwhere appropriate, with differences being indicated with the suffix “d”or with different numerals. Here, a leaking junction is created byprovision of an opposite conductivity type implant 50 into source region28 prior to provision of a barrier layer 36 d. For example wherediffusion region 28 comprises n-type material, region 50 would comprisep-type material. An example p-type dopant concentration for region 50would be 5×10¹⁹ ions/cm³ where peak concentration of the n-type materialof region 28 would be 1×10²⁰ ions/cm³. Such provides another alternateexample of creating a substrate leaking junction relative to the sourcebut not the drain. Less desirable in this embodiment is, however, aperceived need to prevent a diffusion region 50 from being createdwithin drain region 30, thus potentially requiring an interveningmasking step to prevent such implanting.

The invention also contemplates products produced by the above describedprocesses, as well as field effect transistors produced by otherprocesses.

In compliance with the statute, the invention has been described inlanguage more or less specific as to structural and methodical features.It is to be understood, however, that the invention is not limited tothe specific features shown and described, since the means hereindisclosed comprise preferred forms of putting the invention into effect.The invention is, therefore, claimed in any of its forms ormodifications within the proper scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

What is claimed is:
 1. A method of forming a field effect transistor,comprising: forming transistor source and drain diffusion regionsproximate a substrate; forming an opening extending into the sourcediffusion region; forming a barrier conductive material layer over thedrain region and within the opening in the source region; forming atransistor gate proximate the source and drain diffusion regions; andforming respective electrical contacts to the source region and thedrain region, the electrical contact to the source region penetratingthe source region and being separated from the source region by theconductive material layer, the electrical contact to the drain regionbeing separated from the drain region by the conductive material layer.2. The method of claim 1 wherein the conductive material layer comprisesTiN.
 3. A method of forming a field effect transistor, comprising:forming transistor source and drain diffusion regions proximate asubstrate; forming a conductive barrier layer over the drain region andwithin the source region; forming a transistor gate proximate the sourceand drain diffusion regions; and forming respective electrical contactsto the source region and the drain region, the electrical contact to thesource region penetrating the source region and being separated from thesource region by the barrier layer, the electrical contact to the drainregion being separated from the drain region by the barrier layer, theforming the electrical contacts comprising etching a source contactopening at least partially into the source region of the siliconsubstrate, and depositing an electrically conductive material into thesource contact opening.
 4. The method of claim 3 wherein the barrierlayer comprises TiN.
 5. The method of claim 3 wherein the substratecomprises a bulk silicon substrate.
 6. A method of forming a fieldeffect transistor comprising the following steps: forming transistorsource and drain diffusion regions proximate a substrate; forming anopening extending entirely through the source diffusion region: forminga barrier conductive material layer over the drain region and within theopening to extend entirely through the source region; forming atransistor gate proximate the source and drain diffusion regions; andforming respective electrical contacts to the source region and thedrain region, the electrical contact to the source region penetratingentirely through the source region, the electrical contact to the drainregion being separated from the drain region by the electricallyconductive layer.
 7. The method of claim 6 wherein the conductivematerial layer comprises TiN.
 8. A method of forming a field effecttransistor comprising the following steps: forming transistor source anddrain diffusion regions proximate a substrate; forming a conductivebarrier layer over the drain region and entirely through the sourceregion; forming a transistor gate proximate the source and draindiffusion regions; and forming respective electrical contacts to thesource region and the drain region, the electrical contact to the sourceregion penetrating entirely through the source region, the electricalcontact to the drain region being separated from the drain region by thebarrier layer, the forming the electrical contacts comprising etching asource contact opening substantially through the source region withinthe silicon substrate, and depositing an electrically conductivematerial into the source contact opening.
 9. The method of claim 8wherein the barrier layer comprises TiN.
 10. The method of claim 8wherein the substrate comprises a bulk silicon substrate.
 11. A methodof forming a field effect transistor comprising the following steps:providing a silicon substrate having impurity doping of a firstconductivity type; forming source and drain diffusion regions of asecond conductivity type within the silicon substrate, the source regionand the drain region being spaced from one another to define a channelregion therebetween within the silicon substrate; forming a conductivebarrier layer over the drain region and within the source region, thebarrier layer comprising TiN; forming a gate relative to the siliconsubstrate operatively adjacent the channel region; and formingrespective electrical contacts to the source region and the drainregion, the electrical contact to the source region penetrating thesource region and being separated from the source region by the barrierlayer, the electrical contact to the drain region being separated fromthe drain region by the barrier layer, the forming the electricalcontacts comprising etching a source contact opening at least partiallyinto the source region of the silicon substrate, and depositing anelectrically conductive material into the source contact opening.